0.25mm Stainless Steel BGA Net Planting Kit for Nokia Series

Nokia

Description:

• This BGA Net is a 45 set matrix which is needed Cell Phone Repair Tool when you have to exchange BGA parts of your phone
• The BGA Planting Kit supports Nokia 6070 CPU, 8810 CPU, 6230 MF, 3220 CPU, 7610 CPU, 8210 CPU, 3220 Flash, 7200/2600 CPU, 8210 Charge IC, T2688 MF, 8800 CPU, 7650 RAM, 3100 CPU, 7650 CPU, 8310 CPU, N70 CPU, 9500 CPU, 6230 CPU chipsets
• Made of high quality stainless steel sheet materials
• The small grids are molded by laser, durable and not easy to distort when be heated
• Only suitable for professional use, the solder work is not easy, please make sure that you can do it by yourself before your purchase
• Notice: cell phone IC/ CPU/ BGA is not included
• Thickness: 0.25mm
• Total size: about 187 x 62 x 0.25mm (L x W x H)
• Weight: 25g

Nokia