0.25mm BGA Clip Ball IC Solder Steel Arrangement Template Cell Phone Repair Tool

Universal

Description:

• This is a Cell Phone Repair Tool for professional
• This BGA Arrangement Template used for solder BGA clip balls/ Cell phone IC/ Cell phone CPU
• Made of high quality stainless steel sheet materials
• The small grids are molded by laser, durable and not easy to distort when be heated
• This BGA Clip Ball Solder Template contains many types of cell phone’s BGA clip ball template, such as Motorola V3/V3i flash, Motorola V3x flash, Siements C55 flash, Nokia 7650 MF, Motorola V66 flash, Samsung V208 IC, Nokia 3510 CPU, Nokia 8810 CPU, ect
• This IC Solder Template will help you to save your material in the repair process
• Only suitable for professional use, the solder work is not easy, please make sure that you can do it by yourself before your purchase
• Thickness: 0.25mm
• Total size: about 245 x 95 x 0.25mm (L x W x H)
• Weight: 28g

Universal