0.25mm A80 BGA Clip Ball IC Solder Arrangement Template for Cell Phone Repair

Universal

Description:

• This is a Cell Phone Repair Tool for professional
• This BGA Arrangement Template used for solder BGA clip balls/ Cell phone IC/ Cell phone CPU
• Made of high quality stainless steel sheet materials
• The small grids are molded by laser, durable and not easy to distort when be heated
• This BGA Clip Ball Solder Template contains many types of cell phone’s BGA clip ball template, such as Motorola V300 CPU, A760 CPU, 928  CPU,  N288 CPU, Nokia 8810 CPU,  Nokia 3310/ 3210/3350/2400  CPU, V200 CPU, 6230 UEM, 7200 CPU, 2600 CPU, A760 RAM, 7260 CPU, 3220 CPU, V300 CPU, E700 CPU, E800 CPU, Motorola V3x CPU, T268 CPU, E700 Flash, ect.
  
• This IC Solder Template will help you to save your material in the repair process
• Only suitable for professional use, the solder work is not easy, please make sure that you can do it by yourself before your purchase
• Notice: cell phone CPU/ IC / BGA is not included
• Thickness: 0.25mm
• Total size: about 225x 80 x 0.25mm (L x W x H)
• Weight: 28g

Universal